Storage Environment(儲存環境)

Storage Temp. and Humidity Request(溫溼度條件)

‧Temperature(溫度):45~ -10℃.
‧Humidity(溼度):Under 80%.

Packaging Conditions(包裝條件)
‧Packaging(包裝):
Completely sealed packaging.
(完整密封包裝)
‧Packaging contents(填充物) :
Adding in desiccating agent.
(加入乾燥劑)

 
 
Storage Life(保存期限)

‧The chips could keep one year in this condition . (晶粒在此條件下能存放1年

‧More than one year(如超過一年) : Our company will not guarantee the quality of soldering and electrical function if more than one year. And suggest your company do the solderingand electrical function test before process.

(存放超過一年,敝公司將不保證焊接以及晶粒電性品質,並建議貴公司於投產前進行小樣以確認焊接及電性品質)